BOND CHINA INTERNATIONAL LIMITED

BOND CHINA INTERNATIONAL LIMITED (CR No: 0510670) was incorporated on 07-APR-1995 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0510670
Business Name:
BOND CHINA INTERNATIONAL LIMITED
Business Name(Chinese):
博中國際有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Striking Off
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
07-APR-1995
BOND CHINA INTERNATIONAL LIMITED
博中國際有限公司
« GRACENTRE INTERNATIONAL LIMITED AIMWISE LIMITED »
Comments

This is not the official website of this company. Don't seek support service here please.

No comment
Registered On 07-APR-1995
YUE FUNG HONG INDUSTRIAL CO., LIMITED 裕豐行實業有限公司 Dissolved
SUN MING INTERNATIONAL LIMITED 信銘國際企業有限公司 Dissolved
ELECTRONIC THEATRE CONTROLS ASIA LIMITED 億達時亞洲有限公司 Live
JAYMAX DESIGN LIMITED 進億設計有限公司 Dissolved
LUCKENT MINERAL RESOURCES INVESTMENTS LIMITED 佳地能源投資有限公司 Dissolved
ASIA PACIFIC INDUSTRIAL DEVELOPMENT COMPANY LIMITED 南聯實業股份有限公司 Dissolved
ACME GORICK ENVIRONMENTAL LIMITED 勵栢環保工程有限公司 Dissolved
WISEFORD ENTERPRISES LIMITED 創天企業有限公司 Dissolved
ALLIED POWER ENTERPRISES LIMITED 天龍企業有限公司 Dissolved
CHINA WINNER INVESTMENT LIMITED 裕璟投資有限公司 Dissolved
Similar Names
BONDWING LIMITED 倍毅有限公司 Dissolved
BOND ARRAY ELECTRONICS LIMITED 邦域電子有限公司 Dissolved
BONDFAIR INTERNATIONAL LIMITED 普輝國際有限公司 Live
BONDTECH INTERNATIONAL LIMITED 普迪國際有限公司 Dissolved
BONDEX INDUSTRIAL LIMITED 普迪實業有限公司 Dissolved
BOND TECHNOLOGY LIMITED 怡邦科技有限公司 Dissolved
BONDNEX INDUSTRIAL LIMITED 寶迪亞實業有限公司 Live
BONDWAY ENGINEERING LIMITED 鵬威工程有限公司 Dissolved
BOND SMART DEVELOPMENT LIMITED 鵬昇發展有限公司 Dissolved
BOND MAKE DEVELOPMENT LIMITED 鵬旺發展有限公司 Dissolved