BOND TECHNOLOGY LIMITED

BOND TECHNOLOGY LIMITED (CR No: 0503753) was incorporated on 24-JAN-1995 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0503753
Business Name:
Business Name(Chinese):
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Striking Off
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Name History
24-JAN-1995
BOND TECHNOLOGY LIMITED
怡邦科技有限公司
Comments

This is not the official website of this company. Don't seek support service here please.

No comment
Registered On 24-JAN-1995
GREAT WELL CONSULTANTS LIMITED 宏威顧問有限公司 Dissolved
WING ON CONSULTANTS LIMITED 永安顧問有限公司 Dissolved
ZELA LIMITED 瑞亞有限公司 Dissolved
UNION ASSET LIMITED 盟亞有限公司 Live
LANE ASIA LIMITED 凌亞有限公司 Dissolved
REGULAR LIMITED 悅亞有限公司 Dissolved
SHEEN ASIA TECHNOLOGY LIMITED 信亞科技有限公司 Dissolved
Similar Names
BONDNEX INDUSTRIAL LIMITED 寶迪亞實業有限公司 Live
BONDWAY ENGINEERING LIMITED 鵬威工程有限公司 Dissolved
BOND SMART DEVELOPMENT LIMITED 鵬昇發展有限公司 Dissolved
BOND MAKE DEVELOPMENT LIMITED 鵬旺發展有限公司 Dissolved
BOND FULL DEVELOPMENT LIMITED 鵬富發展有限公司 Dissolved
BOND GRAND DEVELOPMENT LIMITED 鵬展發展有限公司 Dissolved
BONDMAX INVESTMENTS LIMITED 邦盟投資有限公司 Dissolved
BONDMAX DEVELOPMENTS LIMITED 邦盟發展有限公司 Dissolved
BONDPRO INVESTMENTS LIMITED 邦寶投資有限公司 Live
BONDEAST INVESTMENTS LIMITED 邦怡投資有限公司 Dissolved