BOND TECHNOLOGY LIMITED

BOND TECHNOLOGY LIMITED (CR No: 0503753) was incorporated on 24-JAN-1995 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0503753
Business Name:
BOND TECHNOLOGY LIMITED
Business Name(Chinese):
怡邦科技有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Striking Off
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
24-JAN-1995
BOND TECHNOLOGY LIMITED
怡邦科技有限公司
« SUMMIT OUTFITTERS LIMITED WAI MING (UNITY) COMPANY LIMITED »
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