YICK BOND TECHNOLOGIES LIMITED

YICK BOND TECHNOLOGIES LIMITED (CR No: 1898471) was incorporated on 26-APR-2013 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
1898471
Business Name:
YICK BOND TECHNOLOGIES LIMITED
Business Name(Chinese):
益邦科技有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Deregistration
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
26-APR-2013
YICK BOND TECHNOLOGIES LIMITED
益邦科技有限公司
« CSG INDUSTRIAL CO., LIMITED SUNLING INDUSTRIAL CO., LIMITED »
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