SEMICONDUCTOR MOLD & DIE LIMITED

SEMICONDUCTOR MOLD & DIE LIMITED (CR No: 0255807) was incorporated on 21-JUN-1989 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0255807
Business Name:
SEMICONDUCTOR MOLD & DIE LIMITED
Business Name(Chinese):
半導體模具製作有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Deregistration
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
02-MAY-1996
SEMICONDUCTOR MOLD & DIE LIMITED
半導體模具製作有限公司
18-FEB-1993
SEMICONDUCTOR MOLD & DIES LIMITED
半導體模具製作有限公司
17-NOV-1992
SEMI-CONDUCTOR MOLD & DIES LIMITED
半導體模具製作有限公司
21-JUN-1989
KUK JE MOLD & DIES (INTERNATIONAL) LIMITED
« M. RICH (HONG KONG) LIMITED LEADMILES INVESTMENT LIMITED »
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