HONGKONG BONDTECH CO., LIMITED

HONGKONG BONDTECH CO., LIMITED (CR No: 0907834) was incorporated on 21-Jun-2004 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0907834
Business Name:
HONGKONG BONDTECH CO., LIMITED
Business Name(Chinese):
香港邦泰科技有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
已告解散(註冊撤銷)
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
2004年6月21日
HONGKONG BONDTECH CO., LIMITED
香港邦泰科技有限公司
« HIP FUNG METAL COMPANY LIMITED FASHION GROUP (HK) HOLDING LIMITED »
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