HK BOND ELECTRONIC TECH DEVELOPMENT LIMITED

HK BOND ELECTRONIC TECH DEVELOPMENT LIMITED (CR No: 1843267) was incorporated on 24-DEC-2012 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
1843267
Business Name:
HK BOND ELECTRONIC TECH DEVELOPMENT LIMITED
Business Name(Chinese):
香港邦德電子科技發展有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Striking Off
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
24-DEC-2012
HK BOND ELECTRONIC TECH DEVELOPMENT LIMITED
香港邦德電子科技發展有限公司
« BLOSSOMING CERTIFIED PUBLIC ACCOUNTANTS LIMITED HK CHANGXIN SPECIAL ALLOY GROUP LIMITED »
Comments

This is not the official website of this company. Don't seek support service here please.

No comment
Registered On 24-DEC-2012
B & G INTL LIMITED Dissolved
CHAOQUN LEGEND HOLDINGS GROUP LIMITED 超群傳奇控股集團有限公司 Dissolved
VGH Capital Limited Dissolved
Z STAR LIMITED Dissolved
DA PENG INDUSTRIES (HK) LIMITED 大鵬實業(香港)有限公司 Dissolved
Ji Zhi Hui International Club Holding Limited 極致薈國際俱樂部股份有限公司 Dissolved
YIDING LOGISTICS LIMITED 一鼎物流有限公司 Live
XICOSEN TECHNOLOGY LIMITED 西克森科技有限公司 Dissolved
LEE INDUSTRIAL EQUIPMENT LIMITED Dissolved
AIWUJIN (CHINA) LIMITED 愛無盡(中國)有限公司 Dissolved
Similar Names
Bondolar International Co., Limited 邦多拉國際貿易有限公司 Live
Bond Stone Investment Limited 香港眾滙投資有限公司 Dissolved
BONDLY CHINA (HK) LIMITED 邦利中國(香港)有限公司 Live
Bond Company (HK) Limited -The- 德栢集團(香港)有限公司 Dissolved
BOND TACT INDUSTRIAL (HK) LIMITED 兆傑實業(香港)有限公司 Dissolved
BONDISTRI TRADING LIMITED 邦迪思貿易有限公司 Dissolved
BOND ASIA H.K. LIMITED Live
BONDNEXT PLASTIC LIMITED 邦歴塑膠原料有限公司 Dissolved
BOND OF HEARTS HK LIMITED 邦德客香港有限公司 Live
BOND MIX INTERNATIONAL LIMITED 邦美斯國際有限公司 Live