GOLD BOND ENGINEERING MATERIALS LIMITED

GOLD BOND ENGINEERING MATERIALS LIMITED (CR No: 1063221) was incorporated on 29-JUL-2006 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
1063221
Business Name:
GOLD BOND ENGINEERING MATERIALS LIMITED
Business Name(Chinese):
金邦工程物料有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Deregistration
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
29-JUL-2006
GOLD BOND ENGINEERING MATERIALS LIMITED
金邦工程物料有限公司
« HONG KONG HONEST GROUP LIMITED HONG KONG CHINA DRAGON PROPERTIES LIMITED »
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