BONDS TECHNOLOGY LIMITED

BONDS TECHNOLOGY LIMITED (CR No: 0863313) was incorporated on 26-Sep-2003 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0863313
Business Name:
Business Name(Chinese):
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
已告解散(註冊撤銷)
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Name History
2003年9月26日
BONDS TECHNOLOGY LIMITED
邦時科技有限公司
Comments

This is not the official website of this company. Don't seek support service here please.

No comment
Registered On 26-Sep-2003
KOON WING ELECTRONICS (H.K.) COMPANY LIMITED 冠榮電子(香港)有限公司 Dissolved
TIN FU GARMENT AND ACCESSORIES COMPANY LIMITED 天富服飾有限公司 Dissolved
PET LOVER LIMITED 寵愛有限公司 Live
LAYTEX (HK) GARMENTS LIMITED 利達(香港)製衣有限公司 Dissolved
CHUN FAI LOGISTICS LIMITED 晉暉物流有限公司 Dissolved
Similar Names
BONDS INTERNATIONAL TRADING LIMITED 卓豐國際貿易有限公司 Dissolved
BONDS HOLDINGS LIMITED 邦盈集團有限公司 Dissolved
BONDSTONE CAPITAL GROUP LIMITED 龐通金融有限公司 Live
BONDSMART PCB LIMITED 達高電路板有限公司 Dissolved
BONDSMART INDUSTRIAL LIMITED 達高實業有限公司 Dissolved
BONDSMART LIMITED 旭達有限公司 Dissolved
BONDSMART INVESTMENT LIMITED 邦順投資有限公司 Live