BONDS TECHNOLOGY LIMITED

BONDS TECHNOLOGY LIMITED (CR No: 0863313) was incorporated on 26-Sep-2003 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0863313
Business Name:
BONDS TECHNOLOGY LIMITED
Business Name(Chinese):
邦時科技有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
已告解散(註冊撤銷)
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
2003年9月26日
BONDS TECHNOLOGY LIMITED
邦時科技有限公司
« CHINA MASCOT TOBACCO COMPANY LIMITED ASIAN TECHNOLOGY LIMITED »
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