BONDING TECHNOLOGY LIMITED

BONDING TECHNOLOGY LIMITED (CR No: 0278452) was incorporated on 18-MAY-1990 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0278452
Business Name:
BONDING TECHNOLOGY LIMITED
Business Name(Chinese):
佳銘電子實業有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
Dissolved by Deregistration
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
20-AUG-1992
BONDING TECHNOLOGY LIMITED
佳銘電子實業有限公司
07-FEB-1991
BONDING TECHNOLOGY LIMITED
佳銘電子貿易有限公司
18-MAY-1990
BONDING TECHNOLOGY LIMITED
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