BOND WELL HONG KONG TECHNOLOGY LIMITED

BOND WELL HONG KONG TECHNOLOGY LIMITED (CR No: 0636670) was incorporated on 18-Feb-1998 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Live

Company Info
CR No:
0636670
Business Name:
Business Name(Chinese):
Registration Date:
Business Status:
Live
Business Type:
Private company limited by shares
Remarks:
-
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Name History
1998年2月18日
BOND WELL HONG KONG TECHNOLOGY LIMITED
寶華香港科技有限公司
Comments

This is not the official website of this company. Don't seek support service here please.

No comment
Registered On 18-Feb-1998
RIGHT WAY ELECTRONICS LIMITED 確達實業有限公司 Live
HONG KONG LONG FU BANG HOLDINGS LIMITED 香港龍虎榜集團有限公司 Dissolved
RICH PACIFIC DEVELOPMENT (H.K.) LIMITED 裕洋發展有限公司 Dissolved
HITACHI METALS KIKO HONG KONG CO., LIMITED 日立金屬機工香港有限公司 Dissolved
PANPACIFIC INVESTMENT INTERNATIONAL LIMITED 泛太平洋國際投資有限公司 Dissolved
SHEEN TARGET ENGINEERING LIMITED 信達工程有限公司 Dissolved
UNITEX ENGINEERING LIMITED 宇達工程有限公司 Live
Similar Names
BOND FORD LIMITED 寶景有限公司 Dissolved
BOND YIELD INVESTMENT LIMITED 邦益投資有限公司 Live
BONDS (RISK MANAGEMENT) LIMITED 邦裕(風險管理)有限公司 Live
BONDWICH LIMITED Dissolved
BONDWICH DEVELOPMENT LIMITED 沛山發展有限公司 Dissolved
BONDWOOD HOLDINGS LIMITED 沛森集團有限公司 Dissolved
BONDHILL ENTERPRISES LIMITED 沛山企業有限公司 Dissolved
BONDHILL HOLDINGS LIMITED 沛山集團有限公司 Dissolved
BONDWICH ENTERPRISES LIMITED 沛榮企業有限公司 Dissolved