BOND TECH (HONG KONG) LIMITED

BOND TECH (HONG KONG) LIMITED (CR No: 0805605) was incorporated on 10-Jul-2002 in Hong Kong. Their business is recorded as Private company limited by shares. The Company's current operating status is Dissolved

Company Info
CR No:
0805605
Business Name:
BOND TECH (HONG KONG) LIMITED
Business Name(Chinese):
邦得(香港)有限公司
Registration Date:
Business Status:
Dissolved
Business Type:
Private company limited by shares
Remarks:
已告解散(註冊撤銷)
Winding Up Mode:
-
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Added: Updated:
Name History
2002年7月10日
BOND TECH (HONG KONG) LIMITED
邦得(香港)有限公司
« HONG KONG SURE WIN SHOES AND CLOTHING INTERNATIONAL LIMITED KINMA SCIENCE & TECHNOLOGY DEVELOPMENT CO., LIMITED »
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