ASIAN BOND MARKET FORUM LIMITED

ASIAN BOND MARKET FORUM LIMITED (CR No: 0931759) was incorporated on 03-Nov-2004 in Hong Kong. Their business is recorded as 擔保有限公司. The Company's current operating status is Dissolved

Company Info
CR No:
0931759
Business Name:
Business Name(Chinese):
Registration Date:
Business Status:
Dissolved
Business Type:
擔保有限公司
Remarks:
已告解散(成員自動清盤)
Winding Up Mode:
成員自動清盤
Date of Dissolution / Ceasing to Exist:
Register of Charges:
Unavailable
Important Note:
-
Name History
2004年11月3日
ASIAN BOND MARKET FORUM LIMITED
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Registered On 03-Nov-2004
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